E1100S™ heat-curing epoxy adhesive

A strong heat-curing adhesive for adhesion testing of thermal resistant coatings

Pull-off testing of strong coatings requires strong glue.

The E1100S™ heat-curing epoxy is a versatile glue which cures at temperatures between 120°C and 200°C to tensile strength of more than 70 MPa (measured with the PAT adhesion tester). This adhesive is particularly suitable for thermal sprayed coatings tested either on test panels, (ISO 4624 or ASTM D4541), or in accordance with ASTM C633 (two test cylinders glued together).

Sold in 5ml syringes.

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